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 CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
FLEx36TM 3.3V 32K/64K/128K/256K/512 x 36 Synchronous Dual-Port RAM
Features

Functional Description
The FLEx36 family includes 1-Mbit, 2-Mbit, 4-Mbit, 9-Mbit, and 18-Mbit pipelined, synchronous, true dual-port static RAMs that are high-speed, low-power 3.3V CMOS. Two ports are provided, permitting independent, simultaneous access to any location in memory. A particular port can write to a certain location while another port is reading that location. The result of writing to the same location by more than one port at the same time is undefined. Registers on control, address, and data lines allow for minimal setup and hold time. During a Read operation, data is registered for decreased cycle time. Each port contains a burst counter on the input address register. After externally loading the counter with the initial address, the counter increments the address internally (more details to follow). The internal Write pulse width is independent of the duration of the R/W input signal. The internal Write pulse is self-timed to allow the shortest possible cycle times. A HIGH on CE0 or LOW on CE1 for one clock cycle powers down the internal circuitry to reduce the static power consumption. One cycle with chip enables asserted is required to reactivate the outputs. Additional features include: readback of burst-counter internal address value on address lines, counter-mask registers to control the counter wrap-around, counter interrupt (CNTINT) flags, readback of mask register value on address lines, retransmit functionality, interrupt flags for message passing, JTAG for boundary scan, and asynchronous Master Reset (MRST). The CYD18S36V devices in this family has limited features. Please see Address Counter and Mask Register Operations[19] on page 5 for details.
True dual-ported memory cells that allow simultaneous access of the same memory location Synchronous pipelined operation Family of 1-Mbit, 2-Mbit, 4-Mbit, 9-Mbit and 18-Mbit devices Pipelined output mode allows fast operation 0.18 micron CMOS for optimum speed and power High-speed clock to data access 3.3V low power Active as low as 225 mA (typ.) Standby as low as 55 mA (typ.) Mailbox function for message passing Global master reset Separate byte enables on both ports Commercial and industrial temperature ranges IEEE 1149.1-compatible JTAG boundary scan 256 Ball FBGA (1-mm pitch) Counter wrap around control Internal mask register controls counter wrap-around Counter-interrupt flags to indicate wrap-around Memory block retransmit operation Counter readback on address lines Mask register readback on address lines Dual Chip Enables on both ports for easy depth expansion Seamless migration to next-generation dual-port family


Seamless Migration to Next-Generation Dual-Port Family
Cypress offers a migration path for all devices in this family to the next-generation devices in the Dual-Port family with a compatible footprint. Please contact Cypress Sales for more details.
Table 1. Product Selection Guide Density Part Number Max. Speed (MHz) Max. Access Time - Clock to Data (ns) Typical Operating Current (mA) Package 1 Mbit (32K x 36) CYD01S36V 167 4.0 225 2 Mbit (64K x 36) CYD02S36V 167 4.4 225 4 Mbit (128K x 36) CYD04S36V 167 4.0 225 9 Mbit (256K x 36) CYD09S36V 167 4.0 270 18 Mbit (512K x 36) CYD18S36V 133 5.0 315
256 FBGA 256 FBGA 256 FBGA 256 FBGA 256 FBGA (17 mm x 17 mm) (17 mm x 17 mm) (17 mm x 17 mm) (17 mm x 17 mm) (23 mm x 23 mm)
Cypress Semiconductor Corporation Document Number: 38-06076 Rev. *F
*
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised March 12, 2008
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Logic Block Diagram[1]
FTSELL CONFIG Block PORTSTD[1:0]L CONFIG Block PORTSTD[1:0]R FTSELR
DQ [35:0]L BE [3:0]L CE0L CE1L OEL R/WL
IO Control
IO Control
DQ [35:0]R BE [3:0]R CE0R CE1R OER R/WR
Dual Ported Array
BUSYL
Arbitration Logic
BUSYR
A [18:0]L CNT/MSKL ADSL CNTENL CNTRSTL RETL CNTINTL CL WRPL
Address & Counter Logic
Address & Counter Logic
A [18:0]R CNT/MSKR ADSR CNTENR CNTRSTR RETR CNTINTR CR WRPR
Mailboxes INTL INTR JTAG
TRST TMS TDI TDO TCK
READYL LowSPDL
RESET LOGIC
MRST READYR LowSPDR
Note 1. 18-Mbit device has 19 address bits, 9-Mbit device has 18 address bits, 4-Mbit device has 17 address bits, 2-Mbit device has 16 address bits, and 1-Mbit device has 15 address bits.
Document Number: 38-06076 Rev. *F
Page 2 of 28
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Pin Configurations
Figure 1. Pin Diagram - 256-Ball FBGA (Top View) CYD01S36V/CYD02S36V/CYD04S36V/CYD09S36V/CYD18S36V
1 A
DQ32L
2
DQ30L
3
DQ28L
4
DQ26L
5
DQ24L
6
DQ22L
7
DQ20L
8
DQ18L
9
DQ18R
10
DQ20R
11
DQ22R
12
DQ24R
13
DQ26R
14
DQ28R
15
DQ30R
16
DQ32R
B
DQ33L
DQ31L
DQ29L
DQ27L
DQ25L
DQ23L
DQ21L
DQ19L
DQ19R
DQ21R
DQ23R
DQ25R
DQ27R
DQ29R
DQ31R
DQ33R
C
DQ34L
DQ35L
RETL [2,3]
INTL
NC [2,5]
NC [2,5]
REVL [2,4]
TRST [2,5]
MRST
NC [2,5]
NC [2,5]
NC [2,5]
INTR
RETR [2,3]
DQ35R
DQ34R
D
A0L
A1L
WRPL [2,3]
VREFL [2,4]
FTSELL [2,3]
LOWSPDL [2,4]
VSS
VTTL
VTTL
VSS
LOWSPDR [2,4]
FTSELR [2,3]
VREFL [2,4]
WRPR [2,3]
A1R
A0R
E
A2L
A3L
CE0L [11]
CE1L [10]
VDDIOL
VDDIOL
VDDIOL
VCORE
VCORE
VDDIOR
VDDIOR
VDDIOR
CE1R [10]
CE0R [11]
A3R
A2R
F
A4L
A5L
CNTINTL [12]
BE3L
VDDIOL
VSS
VSS
VSS
VSS
VSS
VSS
VDDIOR
BE3R
CNTINTR [12]
A5R
A4R
G
A6L
A7L
BUSYL [2,5]
BE2L
REVL [2,3]
VSS
VSS
VSS
VSS
VSS
VSS
VDDIOR
BE2R
BUSYR [2,5]
A7R
A6R
H
A8L
A9L
CL
VTTL
VCORE
VSS
VSS
VSS
VSS
VSS
VSS
VCORE
VTTL
CR
A9R
A8R
J
A10L
A11L
VSS
PORTSTD1 L[2,4]
VCORE
VSS
VSS
VSS
VSS
VSS
VSS
VCORE
PORTSTD1 R[2,4]
VSS
A11R
A10R
K
A12L
A13L
OEL
BE1L
VDDIOL
VSS
VSS
VSS
VSS
VSS
VSS
VDDIOR
BE1R
OER
A13R
A12R
L
A14L
A15L [6]
ADSL [11]
BE0L
VDDIOL
VSS
VSS
VSS
VSS
VSS
VSS
VDDIOR
BE0R
ADSR [11]
A15R [6]
A14R
M
A16L [7]
A17L [8]
R/WL
REVL [2,4]
VDDIOL
VDDIOL
VDDIOL
VCORE
VCORE
VDDIOR
VDDIOR
VDDIOR
REVR [2,4]
R/WR
A17R [8]
A16R [7]
N
A18L [9]
A19L [2,5]
CNT/MSKL [10]
VREFL [2,4]
PortSTD0L [2,4]
READYL [2,5]
REVL [2,3]
VTTL
VTTL
REVR [2,3]
READYR [2,5]
PortSTD0R [2,4]
VREFR [2,4]
CNT/MSKR [10]
A19R [2,5]
A18R [9]
P
DQ16L
DQ17L
CNTENL [11]
CNTRSTL [10]
NC [2,5]
NC [2,5]
TCK
TMS
TDO
TDI
NC [2,5]
NC [2,5]
CNTRSTR [10]
CNTENR [11]
DQ17R
DQ16R
R
DQ15L
DQ13L
DQ11L
DQ9L
DQ7L
DQ5L
DQ3L
DQ1L
DQ1R
DQ3R
DQ5R
DQ7R
DQ9R
DQ11R
DQ13R
DQ15R
T
DQ14L
DQ12L
DQ10L
DQ8L
DQ6L
DQ4L
DQ2L
DQ0L
DQ0R
DQ2R
DQ4R
DQ6R
DQ8R
DQ10R
DQ12R
DQ14R
Notes 2. This ball represents a next generation Dual-Port feature. For more information about this feature, contact Cypress Sales. 3. Connect this ball to VDDIO. For more information about this next generation Dual-Port feature contact Cypress Sales. 4. Connect this ball to VSS. For more information about this next generation Dual-Port feature, contact Cypress Sales. 5. Leave this ball unconnected. For more information about this feature, contact Cypress Sales. 6. Leave this ball unconnected for 32K x 36configuration. 7. Leave this ball unconnected for a 64K x 36, 32K x 36 configurations. 8. Leave this ball unconnected for a 128K x 36, 64K x 36 and 32K x 36 configurations. 9. Leave this ball unconnected for a 256K x 36, 128K x 36, 64K x 36, and 32K x 36 configurations. 10. These balls are not applicable for CYD18S36V device. They need to be tied to VDDIO. 11. These balls are not applicable for CYD18S36V device. They need to be tied to VSS. 12. These balls are not applicable for CYD18S36V device. They need to be no connected.
Document Number: 38-06076 Rev. *F
Page 3 of 28
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Pin Definitions
Left Port A0L-A18L BE0L-BE3L BUSYL[2,5] CL CE0L
[11]
Right Port A0R-A18R BE0R-BE3R BUSYR[2,5] CR CE0R[11] CE1R[10] DQ0R-DQ35R OER INTR Address Inputs.
Description Byte Enable Inputs. Asserting these signals enables Read and Write operations to the corresponding bytes of the memory array. Port Busy Output. When the collision is detected, a BUSY is asserted. Input Clock Signal. Active Low Chip Enable Input. Active High Chip Enable Input. Data Bus Input/Output. Output Enable Input. This asynchronous signal must be asserted LOW to enable the DQ data pins during Read operations. Mailbox Interrupt Flag Output. The mailbox permits communications between ports. The upper two memory locations can be used for message passing. INTL is asserted LOW when the right port writes to the mailbox location of the left port, and vice versa. An interrupt to a port is deasserted HIGH when it reads the contents of its mailbox. Port Low Speed Select Input. Port Address/Control/Data IO Standard Select Inputs. Read/Write Enable Input. Assert this pin LOW to write to, or HIGH to Read from the dual port memory array. Port Ready Output. This signal is asserted when a port is ready for normal operation. Port Counter/Mask Select Input. Counter control input. Port Counter Address Load Strobe Input. Counter control input. Port Counter Enable Input. Counter control input. Port Counter Reset Input. Counter control input. Port Counter Interrupt Output. This pin is asserted LOW when the unmasked portion of the counter is incremented to all "1s". Port Counter Wrap Input. The burst counter wrap control input. Port Counter Retransmit Input. Counter control input. Flow-Through Select. Use this pin to select Flow-Through mode. When is de-asserted, the device is in pipelined mode. Port External High-Speed IO Reference Input. Port IO Power Supply. Reserved pins for future features. Master Reset Input. MRST is an asynchronous input signal and affects both ports. A maser reset operation is required at power up. JTAG Reset Input. JTAG Test Mode Select Input. It controls the advance of JTAG TAP state machine. State machine transitions occur on the rising edge of TCK. JTAG Test Data Input. Data on the TDI input is shifted serially into selected registers. JTAG Test Clock Input. JTAG Test Data Output. TDO transitions occur on the falling edge of TCK. TDO is normally three-stated except when captured data is shifted out of the JTAG TAP. Ground Inputs. Core Power Supply. LVTTL Power Supply for JTAG IOs
[2,4]
CE1L[10] DQ0L-DQ35L OEL INTL
LowSPDL[2,4] PORTSTD[1:0]L R/WL READYL[2,5] CNT/MSKL
[10] [2,4]
LowSPDR[2,4] PORTSTD[1:0]R R/WR READYR[2,5] CNT/MSKR[10] ADSR[11] CNTENR[11] CNTRSTR[10] CNTINTR[12] WRPR[2,3] RETR[2,3] FTSELR
[2,3]
ADSL[11] CNTENL[11] CNTRSTL[10] CNTINTL[12] WRPL[2,3] RETL
[2,3]
FTSELL[2,3] VREFL[2,4] VDDIOL REVL
[2, 3, 4]
VREFR[2,4] VDDIOR REVR[2, 3, 4] MRST TRST[2,5] TMS TDI TCK TDO VSS VCORE[13] VTTL
Document Number: 38-06076 Rev. *F
Page 4 of 28
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Master Reset
The FLEx36 family devices undergo a complete reset by taking its MRST input LOW. The MRST input can switch asynchronously to the clocks. An MRST initializes the internal burst counters to zero, and the counter mask registers to all ones (completely unmasked). MRST also forces the Mailbox Interrupt (INT) flags and the Counter Interrupt (CNTINT) flags HIGH. MRST must be performed on the FLEx36 family devices after power up.
Address Counter and Mask Register Operations[19]
This section describes the features only apply to 1Mbit, 2 Mbit, 4 Mbit and 9 Mbit devices. It does not apply to 18Mbit device. Each port of these devices has a programmable burst address counter. The burst counter contains three registers: a counter register, a mask register, and a mirror register. The counter register contains the address used to access the RAM array. It is changed only by the Counter Load, Increment, Counter Reset, and by master reset (MRST) operations. The mask register value affects the Increment and Counter Reset operations by preventing the corresponding bits of the counter register from changing. It also affects the counter interrupt output (CNTINT). The mask register is changed only by the Mask Load and Mask Reset operations, and by the MRST. The mask register defines the counting range of the counter register. It divides the counter register into two regions: zero or more "0s" in the most significant bits define the masked region, one or more "1s" in the least significant bits define the unmasked region. Bit 0 may also be "0," masking the least significant counter bit and causing the counter to increment by two instead of one.l The mirror register is used to reload the counter register on increment operations (see "retransmit," below). It always contains the value last loaded into the counter register, and is changed only by the Counter Load, and Counter Reset operations, and by the MRST. Table 3 on page 6 summarizes the operation of these registers and the required input control signals. The MRST control signal is asynchronous. All the other control signals in Table 3 on page 6 (CNT/MSK, CNTRST, ADS, CNTEN) are synchronized to the port's CLK. All these counter and mask operations are independent of the port's chip enable inputs (CE0 and CE1).
Mailbox Interrupts
The upper two memory locations may be used for message passing and permit communications between ports. Table 2 shows the interrupt operation for both ports of CYD18S36V. The highest memory location, 7FFFF is the mailbox for the right port and 7FFFE is the mailbox for the left port. Table 2 shows that to set the INTR flag, a Write operation by the left port to address 7FFFF asserts INTR LOW. At least one byte must be active for a Write to generate an interrupt. A valid Read of the 7FFFF location by the right port resets INTR HIGH. At least one byte must be active in order for a Read to reset the interrupt. When one port Writes to the other port's mailbox, the INT of the port that the mailbox belongs to is asserted LOW. The INT is reset when the owner (port) of the mailbox Reads the contents of the mailbox. The interrupt flag is set in a flow-thru mode (i.e., it follows the clock edge of the writing port). Also, the flag is reset in a flow-thru mode (i.e., it follows the clock edge of the reading port). Each port can read the other port's mailbox without resetting the interrupt. And each port can write to its own mailbox without setting the interrupt. If an application does not require message passing, INT pins must be left open.
Table 2. Interrupt Operation Example [1, 14, 15, 16, 17, 18] Function Set Right INTR Flag Reset Right INTR Flag Set Left INTL Flag Reset Left INTL Flag Left Port R/WL L X X H CEL L X X L A0L-18L 7FFFF X X 7FFFE INTL X X L H R/WR X H L X CER X L L X Right Port A0R-18R X 7FFFF 7FFFE X INTR L H X X
Notes 13. This family of Dual-Ports does not use VCORE, and these pins are internally NC. The next generation Dual-Port family, the FLEx36-ETM, uses VCORE of 1.5V or 1.8V. Please contact local Cypress FAE for more information. 14. CE is internal signal. CE = LOW if CE0 = LOW and CE1 = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the CLK and can be deasserted after that. Data is out after the following CLK edge and is three-stated after the next CLK edge. 15. OE is "Don't Care" for mailbox operation. 16. At least one of BE0, BE1, BE2, or BE3 must be LOW. 17. A17x is a NC for CYD04S36V, therefore the Interrupt Addresses are 1FFFF and 1FFFE. A17x and A16x are NC for CYD02S36V, therefore the Interrupt Addresses are FFFF and FFFE; A17x, A16x and A15x are NC for CYD01S36V, therefore the Interrupt Addresses are 7FFF and 7FFE. 18. "X" = "Don't Care," "H" = HIGH, "L" = LOW. 19. This section describes the CYD09S36V, CYD04S36V, CYD02S36V, and CYD01S36V which have 18, 17, 16 and 15 address bits.
Document Number: 38-06076 Rev. *F
Page 5 of 28
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Counter enable (CNTEN) inputs are provided to stall the operation of the address input and use the internal address generated by the internal counter for fast, interleaved memory applications. A port's burst counter is loaded when the port's address strobe (ADS) and CNTEN signals are LOW. When the port's CNTEN is asserted and the ADS is deasserted, the address counter increments on each LOW to HIGH transition of that port's clock signal. This Read's or Write's one word from/into each successive address location until CNTEN is deasserted. The counter can address the entire memory array, and loops back to the start. Counter reset (CNTRST) is used to reset the unmasked portion of the burst counter to 0s. A counter-mask register is used to control the counter wrap.
Counter Reset Operation
All unmasked bits of the counter and mirror registers are reset to "0." All masked bits remain unchanged. A Mask Reset followed by a Counter Reset resets the counter and mirror registers to 00000, as does master reset (MRST).
Counter Load Operation
The address counter and mirror registers are both loaded with the address value presented at the address lines.
Table 3. Address Counter and Counter-Mask Register Control Operation (Any Port) [18, 20] CLK X MRST L H H H H H H H H H CNT/MSK X H H H H H L L L L CNTRST X L H H H H L H H H ADS X X L L H H X L L H CNTEN X X L H L H X L H X Operation Master Reset Counter Reset Counter Load Counter Readback Counter Increment Counter Hold Mask Reset Mask Load Mask Readback Reserved Description Reset address counter to all 0s and mask register to all 1s. Reset counter unmasked portion to all 0s. Load counter with external address value presented on address lines. Read out counter internal value on address lines. Internally increment address counter value. Constantly hold the address value for multiple clock cycles. Reset mask register to all 1s. Load mask register with value presented on the address lines. Read out mask register value on address lines. Operation undefined
Note 20. Counter operation and mask register operation is independent of chip enables.
Document Number: 38-06076 Rev. *F
Page 6 of 28
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Counter Increment Operation
Once the address counter register is initially loaded with an external address, the counter can internally increment the address value, potentially addressing the entire memory array. Only the unmasked bits of the counter register are incremented. The corresponding bit in the mask register must be a "1" for a counter bit to change. The counter register is incremented by 1 if the least significant bit is unmasked, and by 2 if it is masked. If all unmasked bits are "1," the next increment wraps the counter back to the initially loaded value. If an Increment results in all the unmasked bits of the counter being "1s," a counter interrupt flag (CNTINT) is asserted. The next Increment returns the counter register to its initial value, which was stored in the mirror register. The counter address can instead be forced to loop to 00000 by externally connecting CNTINT to CNTRST.[21] An increment that results in one or more of the unmasked bits of the counter being "0" de-asserts the counter interrupt flag. The example in Figure 3 on page 9 shows the counter mask register loaded with a mask value of 0003Fh unmasking the first 6 bits with bit "0" as the LSB and bit "16" as the MSB. The maximum value the mask register can be loaded with is 3FFFFh. Setting the mask register to this value allows the counter to access the entire memory space. The address counter is then loaded with an initial value of 8h. The base address bits (in this case, the 6th address through the 16th address) are loaded with an address value but do not increment once the counter is configured for increment operation. The counter address starts at address 8h. The counter increments its internal address value till it reaches the mask register value of 3Fh. The counter wraps around the memory block to location 8h at the next count. CNTINT is issued when the counter reaches its maximum value. after the next rising edge of the port's clock. If address readback occurs while the port is enabled (CE0 LOW and CE1 HIGH), the data lines (DQs) are three-stated. Figure 2 on page 8 shows a block diagram of the operation.
Retransmit
Retransmit is a feature that allows the Read of a block of memory more than once without the need to reload the initial address. This eliminates the need for external logic to store and route data. It also reduces the complexity of the system design and saves board space. An internal "mirror register" is used to store the initially loaded address counter value. When the counter unmasked portion reaches its maximum value set by the mask register, it wraps back to the initial value stored in this "mirror register." If the counter is continuously configured in increment mode, it increments again to its maximum value and wraps back to the value initially stored into the "mirror register." Thus, the repeated access of the same data is allowed without the need for any external logic.
Mask Reset Operation
The mask register is reset to all "1s," which unmasks every bit of the counter. Master reset (MRST) also resets the mask register to all "1s."
Mask Load Operation
The mask register is loaded with the address value presented at the address lines. Not all values permit correct increment operations. Permitted values are of the form 2n - 1 or 2n - 2. From the most significant bit to the least significant bit, permitted values have zero or more "0s," one or more "1s," or one "0." Thus 7FFFF, 003FE, and 00001 are permitted values, but 7F0FF, 003FC, and 00000 are not.
Counter Hold Operation
The value of all three registers can be constantly maintained unchanged for an unlimited number of clock cycles. Such operation is useful in applications where wait states are needed, or when address is available a few cycles ahead of data in a shared bus interface.
Mask Readback Operation
The internal value of the mask register can be read out on the address lines. Readback is pipelined; the address is valid tCM2 after the next rising edge of the port's clock. If mask readback occurs while the port is enabled (CE0 LOW and CE1 HIGH), the data lines (DQs) are three-stated. Figure 2 on page 8 shows a block diagram of the operation.
Counter Interrupt
The counter interrupt (CNTINT) is asserted LOW when an increment operation results in the unmasked portion of the counter register being all "1s." It is deasserted HIGH when an Increment operation results in any other value. It is also de-asserted by Counter Reset, Counter Load, Mask Reset and Mask Load operations, and by MRST.
Counting by Two
When the least significant bit of the mask register is "0," the counter increments by two. This may be used to connect the x36 devices as a 72-bit single port SRAM in which the counter of one port counts even addresses and the counter of the other port counts odd addresses. This even-odd address scheme stores one half of the 72-bit data in even memory locations, and the other half in odd memory locations.
Counter Readback Operation
The internal value of the counter register can be read out on the address lines. Readback is pipelined; the address is valid tCA2
Note 21. CNTINT and CNTRST specs are guaranteed by design to operate properly at speed grade operating frequency when tied together.
Document Number: 38-06076 Rev. *F
Page 7 of 28
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Figure 2. Counter, Mask, and Mirror Logic Block Diagram[1]
CNT/MSK CNTEN ADS CNTRST MRST Decode Logic
Bidirectional Address Lines
Mask Register Counter/ Address Register
Address Decode
RAM Array
CLK
From Address Lines
17 Mirror
Load/Increment Counter
1 1 0 0
To Readback and Address Decode
From Mask Register
17 Increment Logic Wrap
17
From Mask From Counter
17 17 +1 1 +2 0
17 Bit 0 Wrap Detect Wrap
1 0
17
To Counter
Document Number: 38-06076 Rev. *F
Page 8 of 28
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Figure 3. Programmable Counter-Mask Register Operation[1, 22] Example: Load Counter-Mask Register = 3F CNTINT H
0
0
0s
01
1
1
11
1 Mask Register bit-0
216 215 Masked Address Load Address Counter = 8 H XX 216 215 Max Address Register L XX 216 215 Max + 1 Address Register H XX 216 215 Xs Xs Xs
26 25 24 23 22 21 20 Unmasked Address
X0
0
1
00
0 Address Counter bit-0 1
26 25 24 23 22 21 20 X11 1 1 1
26 25 24 23 22 21 20 X00 1 00 0
26 25 24 23 22 21 20
IEEE 1149.1 Serial Boundary Scan (JTAG)[23]
The FLEx36 family devices incorporate an IEEE 1149.1 serial boundary scan test access port (TAP). The TAP controller functions in a manner that does not conflict with the operation of other devices using 1149.1-compliant TAPs. The TAP operates using JEDEC-standard 3.3V IO logic levels. It is composed of three input connections and one output connection required by the test logic defined by the standard.
Boundary Scan Hierarchy for 9-Mbit and 18-Mbit Devices
Internally, the devices have multiple DIEs. Each DIE contains all the circuitry required to support boundary scan testing. The circuitry includes the TAP, TAP controller, instruction register, and data registers. The circuity and operation of the DIE boundary scan are described in detail below. The scan chain for 9-Mbit and 18-Mbit devices uses a hierarchical approach as shown in Figure 4 on page 10 and Figure 5 on page 10. TMS and TCK are connected in parallel to each DIE to drive all 2- or 4-TAP controllers in unison. In many cases, each DIE is supplied with the same instruction. In other cases, it might be useful to supply different instructions to each DIE. One example would be testing the device ID of one DIE while bypassing the rest. Each pin of the devices is typically connected to multiple DIEs. For connectivity testing with the EXTEST instruction, it is desirable to check the internal connections between DIEs and the external connections to the package. This can be accomplished by merging the netlist of the devices with the netlist of the user's circuit board. To facilitate boundary scan testing of the devices, Cypress provides the BSDL file for each DIE, the internal netlist of the device, and a description of the device scan chain. The user can use these materials to easily integrate the devices into the board's boundary scan environment. Further information can be found in the Cypress application note Using JTAG Boundary Scan For System in a Package (SIP) Dual-Port SRAMs.
Performing a TAP Reset
A reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This reset does not affect the operation of the devices, and may be performed while the device is operating. An MRST must be performed on the devices after power up.
Performing a Pause/Restart
When a SHIFT-DR PAUSE-DR SHIFT-DR is performed the scan chain outputs the next bit in the chain twice. For example, if the value expected from the chain is 1010101, the device outputs a 11010101. This extra bit causes some testers to report an erroneous failure for the devices in a scan test. Therefore the tester must be configured to never enter the PAUSE-DR state.
Notes 22. The "X" in this diagram represents the counter upper bits. 23. Boundary scan is IEEE 1149.1-compatible. See "Performing a Pause/Restart" for deviation from strict 1149.1 compliance.
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Figure 4. Scan Chain for 18-Mbit Device
TDO
TDO TDO
D2
TDI TDO
D4
TDI TDO
D1
TDI
D3
TDI
TDI
Figure 5. Scan Chain for 9-Mbit Device
TDO
TDO
D2
TDI TDO
D1
TDI
TDI
Table 4. Identification Register Definitions Instruction Field Revision Number (31:28) Cypress Device ID (27:12) 0h C002h C001h C092h Cypress JEDEC ID (11:1) ID Register Presence (0) Table 5. Scan Register Sizes Register Name Instruction Bypass Identification Boundary Scan Bit Size 4 1 32 n[24] 034h 1 Value Reserved for version number. Defines Cypress part number for CYD04S36V, CYD09S36V and CYD18S36V Defines Cypress part number for CYD02S36V Defines Cypress part number for CYD01S36V Allows unique identification of the DP family device vendor. Indicates the presence of an ID register. Description
Note 24. See details in the device BSDL files.
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Table 6. Instruction Identification Codes Instruction EXTEST BYPASS IDCODE HIGHZ CLAMP SAMPLE/PRELOAD NBSRST RESERVED 0000 1111 1011 0111 0100 1000 1100 All other codes Code Description Captures the Input/Output ring contents. Places the BSR between the TDI and TDO. Places the BYR between TDI and TDO. Loads the IDR with the vendor ID code and places the register between TDI and TDO. Places BYR between TDI and TDO. Forces all device output drivers to a High-Z state. Controls boundary to 1/0. Places BYR between TDI and TDO. Captures the input/output ring contents. Places BSR between TDI and TDO. Resets the non-boundary scan logic. Places BYR between TDI and TDO. Other combinations are reserved. Do not use other than the above.
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Maximum Ratings
Exceeding maximum ratings[25] may shorten the useful life of the device. User guidelines are not tested. Storage Temperature .................................. -65C to +150C Ambient Temperature with Power Applied ............................................ -55C to +125C Supply Voltage to Ground Potential................-0.5V to +4.6V DC Voltage Applied to Outputs in High-Z State .......................... -0.5V to VDD +0.5V DC Input Voltage .............................. -0.5V to VDD + 0.5V[26] Electrical Characteristics Over the Operating Range Parameter VOH VOL VIH VIL IOZ IIX1 IIX2 ICC Description Output HIGH Voltage (VDD = Min, IOH= -4.0 mA) Output LOW Voltage (VDD = Min, IOL= +4.0 mA) Input HIGH Voltage Input LOW Voltage Output Leakage Current Input Leakage Current Except TDI, TMS, MRST Input Leakage Current TDI, TMS, MRST Operating Current for CYD01S36V (VDD = Max.,IOUT = 0 mA), Outputs CYD02S36V/ Disabled CYD04S36V CYD09S36V CYD18S36V ISB1
[27]
Output Current into Outputs (LOW)............................. 20 mA Static Discharge Voltage........................................... > 2000V (JEDEC JESD22-A114-2000B) Latch-up Current..................................................... > 200 mA
Operating Range
Range Commercial Industrial Ambient Temperature 0C to +70C VDDIO/VTTL VCORE[13]
3.3V165 mV 1.8V100 mV
-40C to +85C 3.3V165 mV 1.8V100 mV
-167 Min Typ. Max Min 2.4 0.4 2.0 0.8 -10 -10 -1.0 225 10 10 0.1 300 -10 -10 -1.0 2.0 2.4
-133 Typ. Max 0.4 2.0 0.8 10 10 0.1 225 300 -10 -10 -1.0 Min 2.4
-100 Typ. Max 0.4 0.8 10 10 0.1
Unit V V V V A A mA mA mA
450 90 160 55 160
600 115 210 75 210
370 410 90 160 55 160
540 580 115 210 75 210 75 75 0 0 315 450
mA mA mA mA mA mA mA
Standby Current (Both Ports TTL Level) CEL and CER VIH, f = fMAX Standby Current (One Port TTL Level) CEL | CER VIH, f = fMAX Standby Current (Both Ports CMOS Level) CEL and CER VDD - 0.2V, f = 0 Standby Current (One Port CMOS Level) CEL | CER VIH, f = fMAX Operating Current (VDDIO = Max, CYD18S36V Iout = 0 mA, f = 0) Outputs Disabled Core Operating Current for (VDD = Max, IOUT = 0 mA), Outputs Disabled
ISB2[27] ISB3[27] ISB4[27] ISB5 ICORE[13]
0
0
0
0
Capacitance
Part Number CYD01S36/ CYD02S36V/ CYD04S36V CYD09S36V Parameter[28] CIN COUT CIN COUT Description Input Capacitance Output Capacitance Input Capacitance Output Capacitance Test Conditions TA = 25C, f = 1 MHz, VDD = 3.3V Max 13 10 22 10[29] Unit pF pF pF pF
Notes 25. The voltage on any input or IO pin cannot exceed the power pin during power up. 26. Pulse width < 20 ns. 27. ISB1, ISB2, ISB3 and ISB4 are not applicable for CYD18S36V because it cannot be powered down by using chip enable pins. 28. COUT also references CIO. 29. Except INT and CNTINT which are 20 pF.
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Capacitance (continued)
Part Number CYD18S36V Parameter[28] CIN COUT Description Input Capacitance Output Capacitance Test Conditions Max 40 20 Unit pF pF
AC Test Load and Waveforms
Z0 = 50 OUTPUT C = 10 pF VTH = 1.5V OUTPUT C = 5 pF R2 = 435 R = 50 3.3V R1 = 590
(a) Normal Load (Load 1)
3.0V 90% ALL INPUT PULSES Vss < 2 ns 10%
(b) Three-state Delay (Load 2)
90% 10% < 2 ns
Switching Characteristics Over the Operating Range
-167 Parameter Description CYD01S36V CYD02S36V CYD04S36V CYD09S36V Min fMAX2 tCYC2 tCH2 tCL2 tR[30] tF[30] tSA tHA tSB tHB tSC tHC tSW tHW tSD tHD tSAD tHAD tSCN tHCN Maximum Operating Frequency Clock Cycle Time Clock HIGH Time Clock LOW Time Clock Rise Time Clock Fall Time Address Setup Time Address Hold Time Byte Select Setup Time Byte Select Hold Time Chip Enable Setup Time Chip Enable Hold Time R/W Setup Time R/W Hold Time Input Data Setup Time Input Data Hold Time ADS Setup Time ADS Hold Time CNTEN Setup Time CNTEN Hold Time 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 6.0 2.7 2.7 2.0 2.0 2.5 0.6 2.5 0.6 2.5 0.6 2.5 0.6 2.5 0.6 2.5 0.6 2.5 0.6 Max 167 7.5 3.0 3.0 2.0 2.0 2.2 1.0 2.2 1.0 NA NA 2.2 1.0 2.2 1.0 NA NA NA NA -133 CYD01S36V CYD02S36V CYD04S36V CYD09S36V Min Max 133 7.5 3.4 3.4 2.0 2.0 2.7 1.0 2.7 1.0 NA NA 2.7 1.0 2.7 1.0 NA NA NA NA CYD18S36V Min Max 133 10.0 4.5 4.5 3.0 3.0 -100 CYD18S36V Min Max 100 MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Unit
Note 30. Except JTAG signals (tr and tf < 10 ns [max.]).
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Switching Characteristics Over the Operating Range (continued)
-167 Parameter Description CYD01S36V CYD02S36V CYD04S36V CYD09S36V Min tSRST tHRST tSCM tHCM tOE tOLZ[31, 32] tOHZ[31, 32] tCD2 tCA2 tCM2 tDC tCKLZ[31, 32] tSINT tRINT tSCINT tRCINT tCCS tRS tRS tRSR tRSF tRSINT CNTRST Setup Time CNTRST Hold Time CNT/MSK Setup Time CNT/MSK Hold Time Output Enable to Data Valid OE to Low Z OE to High Z Clock to Data Valid Clock to Counter Address Valid Clock to Mask Register Readback Valid Data Output Hold After Clock HIGH Clock HIGH to Output Low Z Clock to INT Set Time Clock to INT Reset Time Clock to CNTINT Set Time Clock to CNTINT Reset time Clock to Clock Skew Master Reset Pulse Width Master Reset Setup Time Master Reset Recovery Time Master Reset to Outputs Inactive Master Reset to Counter and Mailbox Interrupt Flag Reset Time 1.0 0 1.0 0.5 0.5 0.5 0.5 5.2 5.0 6.0 5.0 10.0 10.0 4.0 4.0 6.7 6.7 5.0 5.0 0 0 4.0 4.4 4.0 4.0 1.0 0 1.0 0.5 0.5 0.5 0.5 6.0 5.0 6.0 5.0 10.0 10.0 4.4 4.4 7.5 7.5 5.7 5.7 2.3 0.6 2.3 0.6 4.4 0 0 4.4 4.4 4.4 4.4 1.0 0 1.0 0.5 0.5 NA NA 5.7 5.0 6.0 5.0 10.0 NA 4.7 4.7 7.5 7.5 NA NA Max -133 CYD01S36V CYD02S36V CYD04S36V CYD09S36V Min 2.5 0.6 2.5 0.6 4.4 0 0 5.5 5.0 NA NA 1.0 0 1.0 0.5 0.5 NA NA 8.0 5.0 8.5 5.0 10.0 NA 5.0 5.0 10.0 10.0 NA NA Max CYD18S36V Min NA NA NA NA 5.5 0 0 5.5 5.2 NA NA Max -100 CYD18S36V Min NA NA NA NA 5.5 Max ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns cycles ns cycles ns ns Unit
tCKHZ[31, 32] Clock HIGH to Output High Z
Port to Port Delays Master Reset Timing
JTAG Timing
Parameter fJTAG tTCYC tTH tTL tTMSS tTMSH Description Maximum JTAG TAP Controller Frequency TCK Clock Cycle Time TCK Clock HIGH Time TCK Clock LOW Time TMS Setup to TCK Clock Rise TMS Hold After TCK Clock Rise 100 40 40 10 10 167/133/100 Min Max 10 Unit MHz ns ns ns ns ns
Notes 31. This parameter is guaranteed by design, but it is not production tested. 32. Test conditions used are Load 2.
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JTAG Timing (continued)
Parameter tTDIS tTDIH tTDOV tTDOX TDI Setup to TCK Clock Rise TDI Hold After TCK Clock Rise TCK Clock LOW to TDO Valid TCK Clock LOW to TDO Invalid 0 Description 167/133/100 Min 10 10 30 Max Unit ns ns ns ns
JTAG Switching Waveform
tTH tTL
Test Clock TCK Test Mode Select TMS
tTMSS
tTCYC tTMSH
tTDIS Test Data-In TDI Test Data-Out TDO
tTDIH
tTDOX
tTDOV
Switching Waveforms
Figure 6. Master Reset
MRST ALL ADDRESS/ DATA LINES ALL OTHER INPUTS TMS tRSINT CNTINT INT TDO tRSF tRSS tRSR ACTIVE tRS
INACTIVE
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Switching Waveforms
(continued) Figure 7. Read Cycle[14, 33, 34, 35, 36]
tCH2 CLK tCYC2 tCL2
CE tSC tSB BE0-BE3 tHC tHB tSC tHC
R/W tSW tSA ADDRESS DATAOUT An 1 Latency tHW tHA An+1 tCD2 Qn tCKLZ OE
tOE
An+2 tDC Qn+1 tOHZ
An+3
Qn+2 tOLZ
Notes 33. OE is asynchronously controlled; all other inputs (excluding MRST and JTAG) are synchronous to the rising clock edge. 34. ADS = CNTEN = LOW, and MRST = CNTRST = CNT/MSK = HIGH. 35. The output is disabled (high-impedance state) by CE = VIH following the next rising edge of the clock. 36. Addresses do not have to be accessed sequentially since ADS = CNTEN = VIL with CNT/MSK = VIH constantly loads the address on the rising edge of the CLK. Numbers are for reference only.
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Switching Waveforms
(continued) Figure 8. Bank Select Read[37, 38]
tCH2 CLK tSA ADDRESS(B1) tSC CE(B1) tCD2 DATAOUT(B1) tSA ADDRESS(B2) A0 tHA A1 tSC CE(B2) tSC DATAOUT(B2) tCKLZ tHC tCD2 Q2 tCKLZ tCKHZ tCD2 Q4 tSC Q0 tDC A2 tHC tHC tCD2 Q1 tDC A3 A4 tCKLZ A5 tCKHZ tCD2 Q3 tCKHZ A0 tHC tHA A1 A2 A3 A4 A5 tCYC2 tCL2
Figure 9. Read-to-Write-to-Read (OE =
tCH2 CLK tCYC2 tCL2
LOW)[36, 39, 40, 41, 42]
CE tSC tHC
tSW R/W tSW ADDRESS tSA DATAIN An tHA tCD2 Qn READ tDC tHW An+1 An+2
tHW
An+2
An+2 tSD tHD Dn+2
An+3
tCKHZ
DATAOUT
NO OPERATION
WRITE
Notes 37. In this depth-expansion example, B1 represents Bank #1 and B2 is Bank #2; each bank consists of one Cypress FLEx36 device from this data sheet. ADDRESS(B1) = ADDRESS(B2). 38. ADS = CNTEN= BE0 - BE3 = OE = LOW; MRST = CNTRST = CNT/MSK = HIGH. 39. Output state (HIGH, LOW, or high-impedance) is determined by the previous cycle control signals. 40. During "No Operation," data in memory at the selected address may be corrupted and must be rewritten to ensure data integrity. 41. CE0 = OE = BE0 - BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 42. CE0 = BE0 - BE3 = R/W = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, since OE = LOW, the Write operation cannot be completed (labelled as no operation). One clock cycle is required to three-state the IO for the Write operation on the next rising edge of CLK.
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Switching Waveforms
(continued) Figure 10. Read-to-Write-to-Read (OE Controlled)[36, 39, 41, 42]
tCH2 CLK tCYC2 tCL2
CE tSC tHC tSW tHW
R/W
tSW An
tHW An+1 tHA An+2 tSD tHD Dn+2 tCD2 Dn+3 tCD2 Qn tOHZ Qn+4 An+3 An+4 An+5
ADDRESS tSA DATAIN
DATAOUT
OE READ WRITE READ
Figure 11. Read with Address Counter Advance[41]
tCH2 CLK tSA ADDRESS tSAD ADS tSAD CNTEN tSCN DATAOUT Qx-1 READ EXTERNAL ADDRESS tHCN Qx tDC READ WITH COUNTER tCD2 Qn tSCN Qn+1 COUNTER HOLD tHCN Qn+2 Qn+3 tHAD An tHAD tHA tCYC2 tCL2
READ WITH COUNTER
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Switching Waveforms
tCH2 CLK tSA ADDRESS An tHA
(continued) Figure 12. Write with Address Counter Advance [42]
tCYC2 tCL2
INTERNAL ADDRESS tSAD ADS tHAD
An
An+1
An+2
An+3
An+4
CNTEN tSCN DATAIN tSD Dn tHD WRITE EXTERNAL ADDRESS tHCN Dn+1 WRITE WITH COUNTER Dn+1 Dn+2 Dn+3 Dn+4
WRITE COUNTER HOLD
WRITE WITH COUNTER
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Switching Waveforms
tCYC2 tCH2 tCL2 CLK tSA ADDRESS INTERNAL ADDRESS An tHA Am Ap
(continued) Figure 13. Counter Reset [43, 44]
Ax tSW tHW
0
1
An
Am
Ap
R/W
ADS
CNTEN tSRST tHRST CNTRST tSD DATAIN tHD
D0
tCD2 Q0 tCKLZ READ ADDRESS 0
tCD2 Q1 Qn
[45] DATAOUT
COUNTER RESET
WRITE ADDRESS 0
READ ADDRESS 1
READ ADDRESS An
READ ADDRESS Am
Notes 43. CE0 = BE0 - BE3 = LOW; CE1 = MRST = CNT/MSK = HIGH. 44. No dead cycle exists during counter reset. A Read or Write cycle may be coincidental with the counter reset. 45. Retransmit happens if the counter remains in increment mode after it wraps to initially loaded value
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Switching Waveforms
tCYC2 tCH2 tCL2 CLK tSA tHA EXTERNAL ADDRESS A0-A16 INTERNAL ADDRESS tSAD tHAD ADS tSCN tHCN CNTEN tCD2 DATAOUT Qx-2 Qx-1 tCKHZ Qn tCKLZ Qn+1 Qn+2 Qn+3 An tCA2 or tCM2 An*
(continued)
Figure 14. Readback State of Address Counter or Mask Register[46, 47, 48, 49]
An
An+1
An+2
An+3
An+4
LOAD EXTERNAL ADDRESS
READBACK COUNTER INTERNAL ADDRESS
INCREMENT
Notes 46. CE0 = OE = BE0 - BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 47. Address in output mode. Host must not be driving address bus after tCKLZ in next clock cycle. 48. Address in input mode. Host can drive address bus after tCKHZ. 49. An * is the internal value of the address counter (or the mask register depending on the CNT/MSK level) being Read out on the address lines.
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Switching Waveforms
(continued)
Figure 15. Left_Port (L_Port) Write to Right_Port (R_Port) Read[50, 51, 52]
tCH2 CLKL tSA L_PORT ADDRESS tSW R/WL tCKHZ tSD Dn tCCS An tHW tHA tCYC2 tCL2
tHD
L_PORT
DATAIN tCYC2 tCL2 tCH2
tCKLZ
CLKR
tSA R_PORT ADDRESS An
tHA
R/WR tCD2
R_PORT
DATAOUT tDC
Qn
Notes 50. CE0 = OE = ADS = CNTEN = BE0 - BE3 = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. 51. This timing is valid when one port is writing, and other port is reading the same location at the same time. If tCCS is violated, indeterminate data is Read out. 52. If tCCS < minimum specified value, then R_Port Reads the most recent data (written by L_Port) only (2 * tCYC2 + tCD2) after the rising edge of R_Port's clock. If tCCS > minimum specified value, then R_Port Reads the most recent data (written by L_Port) (tCYC2 + tCD2) after the rising edge of R_Port's clock.
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Switching Waveforms
(continued) Figure 16. Counter Interrupt and Retransmit[17, 45, 53, 54, 55, 56]
tCH2 CLK tCYC2 tCL2
tSCM
tHCM
CNT/MSK
ADS
CNTEN
COUNTER INTERNAL ADDRESS
3FFFC
3FFFD
3FFFE tSCINT
3FFFF tRCINT
Last_Loaded
Last_Loaded +1
CNTINT
Notes 53. CE0 = OE = BE0 - BE3 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 54. CNTINT is always driven. 55. CNTINT goes LOW when the unmasked portion of the address counter is incremented to the maximum value. 56. The mask register assumed to have the value of 3FFFFh.
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Switching Waveforms
(continued) Figure 17. MailBox Interrupt Timing[57, 58, 59, 60, 61]
tCH2 CLKL tSA L_PORT ADDRESS INTR tCYC2 tCL2 tHA An tSINT tRINT An+1 An+2 An+3 tCYC2 tCL2
7FFFF
tCH2 CLKR
tSA R_PORT ADDRESS Am
tHA Am+1 7FFFF Am+3 Am+4
Table 7. Read/Write and Enable Operation (Any Port)[1, 18, 62, 63, 64] Inputs OE X X X L H X CLK CE0 H X L L L CE1 X L H H H R/W X X L H X Outputs DQ0 - DQ35 High-Z High-Z DIN DOUT High-Z Deselected Deselected Write Read Outputs Disabled Operation
Notes 57. CE0 = OE = ADS = CNTEN = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. 58. Address "7FFFF" is the mailbox location for R_Port of the 9-Mbit device. 59. L_Port is configured for Write operation, and R_Port is configured for Read operation. 60. At least one byte enable (BE0 - BE3) is required to be active during interrupt operations. 61. Interrupt flag is set with respect to the rising edge of the Write clock, and is reset with respect to the rising edge of the Read clock. 62. OE is an asynchronous input signal. 63. When CE changes state, deselection and Read happen after one cycle of latency. 64. CE0 = OE = LOW; CE1 = R/W = HIGH.
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Ordering Information
512K x 36 (18-Mbit) 3.3V Synchronous CYD18S36V Dual-Port SRAM
Speed( MHz) 133 100 Ordering Code CYD18S36V-133BBC CYD18S36V-133BBI CYD18S36V-100BBC CYD18S36V-100BBI Speed( MHz) 167 133 Package Name BB256B BB256B BB256B BB256B Package Name BB256 BB256 BB256 Package Name BB256 BB256 BB256 Package Name BB256 BB256 BB256 Package Name BB256 BB256 BB256 Package Type Operating Range
256-ball Grid Array 23 mm x 23 mm with 1.0-mm pitch (BGA) Commercial 256-ball Grid Array 23 mm x 23 mm with 1.0-mm pitch (BGA) Industrial 256-ball Grid Array 23 mm x 23 mm with 1.0-mm pitch (BGA) Commercial 256-ball Grid Array 23 mm x 23 mm with 1.0-mm pitch (BGA) Industrial Operating Range
256K x 36 (9-Mbit) 3.3V Synchronous CYD09S36V Dual-Port SRAM
Ordering Code CYD09S36V-167BBC CYD09S36V-133BBC CYD09S36V-133BBI Speed( MHz) 167 133 Package Type
256-ball Grid Array 17 mm x 17 mm with 1.0-mm pitch (BGA) Commercial 256-ball Grid Array 17 mm x 17 mm with 1.0-mm pitch (BGA) Commercial 256-ball Grid Array 17 mm x 17 mm with 1.0-mm pitch (BGA) Industrial Operating Range
128K x 36 (4-Mbit) 3.3V Synchronous CYD04S36V Dual-Port SRAM
Ordering Code CYD04S36V-167BBC CYD04S36V-133BBC CYD04S36V-133BBI Speed( MHz) 167 133 Package Type
256-ball Grid Array 17 mm x 17 mm with 1.0-mm pitch (BGA) Commercial 256-ball Grid Array 17 mm x 17 mm with 1.0-mm pitch (BGA) Commercial 256-ball Grid Array 17 mm x 17 mm with 1.0-mm pitch (BGA) Industrial Operating Range
64K x 36 (2-Mbit) 3.3V Synchronous CYD02S36V Dual-Port SRAM
Ordering Code CYD02S36V-167BBC CYD02S36V-133BBC CYD02S36V-133BBI Speed( MHz) 167 133 Package Type
256-ball Grid Array 17 mm x 17 mm with 1.0-mm pitch (BGA) Commercial 256-ball Grid Array 17 mm x 17 mm with 1.0-mm pitch (BGA) Commercial 256-ball Grid Array 17 mm x 17 mm with 1.0-mm pitch (BGA) Industrial Operating Range
32K x 36 (1-Mbit) 3.3V Synchronous CYD01S36V Dual-Port SRAM
Ordering Code CYD01S36V-167BBC CYD01S36V-133BBC CYD01S36V-133BBI Package Type
256-ball Grid Array 17 mm x 17 mm with 1.0-mm pitch (BGA) Commercial 256-ball Grid Array 17 mm x 17 mm with 1.0-mm pitch (BGA) Commercial 256-ball Grid Array 17 mm x 17 mm with 1.0-mm pitch (BGA) Industrial
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Package Diagrams
Figure 18. 256-Ball FBGA (17 x 17 mm) BB256
TOP VIEW
O0.05 M C O0.25 M C A B O0.450.05(256X)-CPLD DEVICES (37K & 39K) PIN 1 CORNER
1 A B C 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
BOTTOM VIEW
PIN 1 CORNER
9 8 7 6 5 4 3 2 1 A B C
O0.50 (256X)-ALL OTHER DEVICES
16 15 14 13 12 11 10
+0.10 -0.05
1.00
D E F G
D E F G
17.000.10
15.00
H J K L
H J K L
N P R T
7.50
M
M N P R T
1.00 B 0.700.05 7.50 0.15 C 15.00 A A SEATING PLANE A1
+0.10 -0.05
0.25 C
17.000.10
0.20(4X)
C
REFERENCE JEDEC MO-192
A1 0.36
0.56
A 1.40 MAX. 1.70 MAX.
0.35
51-85108-*F
Document Number: 38-06076 Rev. *F
Page 26 of 28
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Package Diagrams (continued)
Figure 19. 256-ball FBGA (23 mm x 23 mm x 1.7 mm) BB256B
TOP VIEW
O0.05 M C O0.25 M C A B PIN 1 CORNER
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
O0.50 (256X)
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
+0.10 -0.05
PIN 1 CORNER
A B C
A B C
E F G
1.00
D
D E F G
J K L
15.00
H
23.000.10
H J K L
N P R T
7.50
M
M N P R T
1.00 B 7.50 15.00 0.700.05 1.70 MAX. 0.25 C A 23.000.10
0.15 C
0.20(4X)
SEATING PLANE 0.56
+0.10 -0.05
C
51-85201-*A
JEDEC MO-192
Document Number: 38-06076 Rev. *F
0.35
Page 27 of 28
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CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V
Document History Page
Document Title: CYD01S36V CYD02S36V/CYD04S36V CYD09S36V/CYD18S36V FLEx36TM 3.3V 32K/64K/128K/256K/512 x 36 Synchronous Dual-Port RAM Document Number: 38-06076 REV. ** *A *B ECN NO. 232012 244232 313156 Orig. of Change WWZ WWZ YDT New data sheet Changed pinout Changed FTSEL# to FTSEL in the block diagram Changed pinout D10 from NC to VSS to reflect test mode pin swap, C10 from rev[2,4] to VSS to reflect SC removal. Changed tRSCNTINT to tRSINT Added tRSINT to the master reset timing diagram Added CYD01S36V to data sheet Added ISB5 and changed IIX2 Added CYD18S36V-133BBI to the Ordering Information Section Change Pinout C10 from VSS to NC[2,5] Change Pinout G5 from VDDIOL to REVL[2,3] Added note for VCORE Removed preliminary status Description of Change
*C *D *E *F
321033 327338 365315 2193427
YDT AEQ YDT
NXR/AESA Changed tCD2 and tOE Spec from 4ns to 4.4ns for -167. Template Update.
(c) Cypress Semiconductor Corporation, 2005-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress' product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 38-06076 Rev. *F
Revised March 12, 2008
Page 28 of 28
FLEx36 and FLEx36-E are trademarks of Cypress Semiconductor Corporation. All other trademarks or registered trademarks referenced herein are property of the respective corporations. All products and company names mentioned in this document may be the trademarks of their respective holders.
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